In semiconductor packaging, unstable cover tape peel force and poor sealing are core pain points causing component loss and production line downtime. Traditional single-layer cover tapes struggle with high-speed mounting and harsh environments, leading to yield losses exceeding 5%.
Recently, Xiamen Hatro Electronics Co., Ltd. launched its three-layer composite heat-seal cover tape, featuring a PE base + conductive layer + heat-seal layer structure that completely eliminates poor sealing and peel force fluctuations. The product delivers stable peel force of 0.1–0.3N/15mm, a widened heat-seal temperature range of 120–160℃, compatibility with over 95% of mainstream mounters, and sealing yield improved to 99.9%.
Using a proprietary conductive masterbatch formulation, the cover tape achieves surface resistivity of 10⁵–10⁸Ω/sq, complies with ROHS and REACH standards, and has been validated by international customers including NEC and TDK. It is now in mass production for memory chip and power device packaging, helping customers reduce losses and boost line efficiency.
