Since the beginning of 2026, the global semiconductor packaging and testing (OSAT) industry has ushered in a new cycle driven […]
As the core carrier for carrier tape packaging, reel dimensional accuracy and structural stability directly impact SMT mounting efficiency. Industry
High-end PS conductive materials have long been monopolized by US and Taiwanese enterprises, with a domestic self-sufficiency rate of less
In semiconductor packaging, unstable cover tape peel force and poor sealing are core pain points causing component loss and production
