In the semiconductor packaging field, large-size power devices and modular components (such as high-power IGBT modules, power modules, customized semiconductor […]
With the development of new energy, automotive electronics and industrial control fields, the packaging demand for medium and high power
In the semiconductor packaging field, not all devices are compatible with standard-specification carrier tapes. As a non-standard matching option, 9.5mm
In the semiconductor tape-and-reel packaging field, 12mm embossed carrier tape is the mainstream packaging carrier for medium and low-power devices
In SMT placement production lines, 8mm embossed carrier tape is the mainstream choice for micro-semiconductor device packaging, and the selection
