The LZ602 is a dedicated 8mm carrier tape developed for SC70 packaged transistors. Commonly used in automotive electronics, power management circuits, and industrial control systems, SC70 components require precise packaging to prevent pin damage, electrostatic discharge (ESD), and pick errors during high-speed SMT assembly. The LZ602’s conductive black PC construction provides permanent anti-static protection, while the optimized cavity dimensions ensure a secure fit for the component, eliminating shifting and tipping.
Core Specifications (Compliant with EIA-481 Industry Standards)
| Parameter Name | EIA-481 Industry Standard (mm) | Hatro Custom Parameter (mm) | Practical Advantages |
|---|---|---|---|
| W (Tape Width) | 8±0.10 | 8 | Matches global standard 8mm automatic taping & pick-and-place equipment, stable high-speed feeding without lateral offset, no extra machine parameter adjustment required |
| P1 (Feed Hole Pitch) | 4±0.10 | 4 | Precisely matches standard sprocket feed specification of mainstream SMT equipment, eliminates skip-hole and tape jam during uninterrupted high-speed operation |
| T (Base Thickness) | 0.25±0.02 | 0.25 | Enhanced substrate thickness improves structural rigidity, preventing base deformation under repeated winding and stacking |
| A0 (Cavity Width) | 2.45±0.05 | 2.45 | 1:1 fit with SC70 component width, restricts left-right swing of the chip inside the cavity |
| B0 (Cavity Length) | 2.40±0.05 | 2.40 | Perfectly matches the longitudinal dimension of the SC70 transistor, limits front-back sliding and avoids component tipping |
| K0 (Cavity Depth) | 1.20±0.05 | 1.20 | Optimized depth matches standard SMT suction nozzle stroke, guarantees smooth component absorption and reduces empty pick rate |
| D1 (Draft Angle) | 1.00 | 1.00 | Optimized demolding angle balances smooth mold stripping during production and easy component ejection during pick-and-place |
Key Advantages
- Conductive Black PC Material: Offers permanent anti-static protection (10⁶-10⁹Ω/sq) and light shielding, preventing electrostatic damage to sensitive SC70 semiconductors.
- Enhanced Structural Rigidity: The 0.25mm base thickness provides superior rigidity, preventing warping and deformation in high-temperature or high-stress environments.
- Precision Cavity Design: The 2.45×2.40×1.20mm cavity is tailored for SC70 components, minimizing movement, pick errors, and edge scratching.
- High Durability: PC base offers excellent toughness and temperature resistance, suitable for automotive-grade applications and long-term storage.
- Full Industrial Chain Support: Matched cover tape and plastic reel are available in one order, with 3-day fast mold sampling support for custom modification requirements.
Application Scenarios
- SC70 packaged transistors and small-signal semiconductors
- Automotive electronics, power management circuits, and industrial control systems
- High-volume SMT assembly requiring ESD protection and reliable component holding
Q&A
Q: Why is conductive black PC chosen for SC70 transistor packaging?
A: The black color provides light shielding, while the integral conductive modification ensures permanent anti-static protection without coating failure risks. This combination is critical for protecting sensitive semiconductors from both light and electrostatic damage.
Q: How does the enhanced base thickness benefit the LZ602 carrier tape?
A: The 0.25mm base thickness improves structural rigidity, making the tape more resistant to warping and deformation during production, storage, and transportation. This is especially beneficial for high-stress applications and long-term reel storage.
