LZ606 is a fully customized carrier tape independently developed to match Phoenix’s SC70 packaged transistors. SC70 mini transistors are widely used in power management chips, wearable electronics and automotive small control modules, whose ultra-fine pins and tiny body put strict demands on packaging precision and anti-static capacity. Hatro’s LZ606 solves common production pain points of standard general tape, including component sliding, pin bending and high empty pick rate. The conductive black PC substrate provides dual protection of light shielding and static dissipation, perfectly adapting to long-distance transportation and high-volume continuous SMT assembly of Phoenix’s SC70 semiconductors.
Core Specifications (Compliant with EIA-481 Industry Standards)
| Parameter Name | EIA-481 Industry Standard (mm) | Hatro Custom Parameter (mm) | Practical Advantages |
|---|---|---|---|
| W (Tape Width) | 8±0.10 | 8 | Matches global standard 8mm automatic taping & pick-and-place equipment, stable high-speed feeding without lateral offset, no extra machine parameter adjustment required |
| P1 (Feed Hole Pitch) | 4±0.10 | 4 | Precisely matches standard sprocket feed specification of mainstream SMT equipment, eliminates skip-hole and tape jam during uninterrupted high-speed operation |
| T (Base Thickness) | 0.20±0.02 | 0.20 | Moderate substrate thickness balances bending toughness and forming stability, prevents base deformation after long-time roll winding |
| A0 (Cavity Width) | 2.36±0.05 | 2.36 | 1:1 fit with SC70 component width, restricts left-right swing of the chip inside the cavity |
| B0 (Cavity Length) | 2.40±0.05 | 2.40 | Perfectly matches the longitudinal dimension of the SC70 transistor, limits front-back sliding and avoids component tipping |
| K0 (Cavity Depth) | 1.20±0.05 | 1.20 | Optimized depth matches standard SMT suction nozzle stroke, guarantees smooth component absorption and reduces empty pick rate |
| D1 (Draft Angle) | 0.80 | 0.80 | Low demolding angle realizes tighter cavity forming, avoids component pop-out during high-speed production while ensuring smooth mold stripping |
Key Advantages
- Exclusive Customization for Phoenix SC70: Cavity dimensions are developed based on Phoenix’s actual SC70 component samples, one-to-one fitting chip outline to eliminate pin damage risks unique to generic carrier tapes.
- Conductive Black PC Dual Protection: Integral conductive modification achieves stable 10⁶~10⁹Ω/sq surface resistance, black material blocks ambient light to avoid performance drift of light-sensitive transistors.
- 0.80° Optimized Low Demolding Angle: Balances tight component locking and smooth demolding, greatly reducing component jumping during high-speed taping and mounting.
- Automotive-Grade PC Durability: Resists high and low temperature deformation, crack-free after repeated winding and stacking, meets long-term storage standards of automotive electronic components.
- One-Stop Custom Packaging Solution: Matched cover tape and plastic reels can be supplied together, fast 3-day mold sampling for revised component drawings, dedicated technical engineer tracking for Phoenix’s production line.
Application Scenarios
- Phoenix SC70 packaged small-signal transistors, switching diodes
- Automotive electronics, smart wearables, power management circuit SMT mass production
- Production lines requiring ultra-precise cavity limitation and permanent ESD protection
Q&A
Q: Why customize a special SC70 carrier tape for Phoenix instead of using universal tape?
A: Universal carrier tapes have oversized cavities that cause SC70 tiny chips to shift and bend delicate pins during transportation and mounting. LZ606 is tailor-made according to Phoenix’s actual component size, the compact cavity firmly locks the chip, drastically cutting scrap rate and improving SMT efficiency for Phoenix’s production line.
Q: What advantages does the 0.80° demolding angle bring compared with standard 1.00° tape?
A: The 0.80° angle creates tighter cavity side walls to fix tiny SC70 components, preventing chips from bouncing out during high-speed taping. Our mold flow simulation ensures smooth mold stripping without sticking tape, balancing production stability for both taping and SMT processes.
