LZ613 is a high-rigidity dedicated 12mm carrier tape designed for medium-thick 0855 power semiconductor chips, widely applied in automotive power control boards, industrial switching power supplies and new energy small modules. Ordinary standard 0.20/0.25mm base 12mm tapes cannot withstand the heavy winding tension generated by thick 0855 components, prone to tape body warping and feeding deviation faults. Hatro upgrades the substrate to 0.28mm thick imported conductive PC material, greatly enhancing bending resistance and structural stability to keep the tape flat throughout forming, winding, transportation and SMT feeding.
The customized 3.80×3.95×1.20mm moderate-depth cavity perfectly fits the thickness and outline of 0855 chips, preventing component sinking, extrusion and pin bending. The widened 8mm feed hole pitch increases the contact area with machine drive gears, delivering stronger traction for heavy full tape rolls and eliminating slip and jam during high-speed continuous production. The 1.50° large demolding angle facilitates smooth mold stripping during mass forming and effortless suction nozzle pickup at SMT stations, effectively reducing equipment downtime.
Core Specifications (Compliant with EIA-481 Industry Standards)
| Parameter Name | EIA-481 Standard (mm) | LZ613 Custom Value (mm) | Industrial Practical Advantages |
|---|---|---|---|
| W Tape Width | 12±0.10 | 12 | Universal wide width compatible with all mainstream 12mm taping and SMT placement machines |
| P1 Feed Hole Pitch | 8±0.10 | 8 | Wider sprocket pitch strengthens traction for heavy reels, avoids tape slip and lateral deviation |
| T Base Thickness | 0.28±0.02 | 0.28 | Super thick substrate maximizes rigidity, completely solves warping defects caused by heavy component winding tension |
| A0 Cavity Width | 3.80±0.05 | 3.80 | Precision matched horizontal width of 0855 power chip, limits horizontal chip shift |
| B0 Cavity Length | 3.95±0.05 | 3.95 | Custom length fits vertical outline of 0855 component, prevents front-back sliding and overturn |
| K0 Cavity Depth | 1.20±0.05 | 1.20 | Moderate depth accommodates medium-thick chip body, avoids extrusion damage to component surface and pins |
| D1 Draft Angle | 1.50 | 1.50 | Wide demolding angle accelerates mold forming cycle and ensures smooth chip ejection during mounting |
Core Product Strengths
- Industry-Leading 0.28mm Super Thick PC Substrate: Far higher rigidity than conventional 0.20/0.25mm tapes, fully resists deformation under heavy winding load of thick power chips.
- 8mm Widened Feed Hole Traction Design: Solves feeding slip faults common in standard 4mm pitch tapes when carrying heavy full reels of power semiconductors.
- Exclusive Cavity Calibrated for 0855 Chips: Balanced cavity width, length and depth to lock medium-thick components firmly without pin extrusion risk.
- Integral Conductive Black PC Dual Protection: Permanent 10⁶~10⁹Ω/sq ESD resistance and light shielding, meeting strict automotive electronics component storage standards.
- Automotive-Grade Stable Quality: Raw material passes high and low temperature cycle testing, supports long-term stock storage of automotive power chips, complete custom mold modification service.
Application Scenarios
- 0855 packaged power switching chips, small voltage regulators and automotive control semiconductors
- Automotive electronic control modules, industrial small switching power supplies, new energy battery management auxiliary circuits
- 12mm wide-format production lines with heavy component winding and strict flatness requirements
Q&A
Q: What advantages does the 0.28mm super thick substrate have over standard 0.25mm tapes?
A: 0855 power chips are thicker and heavier than ordinary small components; winding creates large tension on the tape body. Standard thin substrates will permanently curl after long storage. The 0.28mm thick PC base provides enough structural rigidity to keep the tape flat and eliminate machine feeding alarms.
Q: Why adopt 8mm feed hole pitch instead of the common 4mm for LZ613?
A: Full reels loaded with heavy 0855 chips have large overall weight. 4mm small sprocket holes have insufficient gear contact area, leading to slip and tape deviation during high-speed operation. The widened 8mm pitch increases traction force to maintain stable continuous production.
