LZ616 is a high-rigidity 12mm wide carrier tape designed exclusively for bulky ABS-2 industrial control semiconductors, widely deployed in factory automation modules, power switching boards and sensor drive circuits. Ordinary standard PC carrier tapes use outdated raw material formulas prone to brittleness under high-low temperature cycles; Hatro’s new optimized PC composite formula greatly enhances impact resistance and temperature stability, adapting to harsh cross-border logistics and workshop storage environments.
The oversized 5.50×6.68×1.55mm cavity is precisely sized to fully contain the wide, long ABS-2 chip outline, with rounded inner walls to eliminate pin bending and edge abrasion during transportation and high-speed taping. The widened 8mm feed hole pitch increases gear contact area with taping machine drive sprockets, delivering powerful traction for heavy full tape rolls and eliminating slip, deviation and tape breakage during uninterrupted 24-hour mass production. The 1.50° large demolding angle optimizes both mold production efficiency and SMT pickup smoothness, lowering equipment downtime for large-volume industrial assembly lines.
Complete Technical Parameter Table
| Parameter Name | EIA-481 Tolerance (mm) | LZ616 Custom Value (mm) | Production Practical Benefit |
|---|---|---|---|
| W Tape Width | 12±0.10 | 12 | Standard wide format compatible with all mainstream 12mm taping and SMT placement machines globally |
| P1 Feed Hole Pitch | 8±0.10 | 8 | Extended sprocket pitch strengthens traction for heavy ABS-2 loaded tape reels, prevents feeding slip and lateral offset |
| T Base Thickness | 0.25±0.20 | 0.25 | Reinforced new PC substrate balances toughness and flatness, resists brittleness and warping under temperature fluctuations |
| A0 Cavity Width | 5.50±0.05 | 5.50 | Wide pocket fully accommodates the broad body of ABS-2 industrial chips, limits horizontal component shift |
| B0 Cavity Length | 6.68±0.05 | 6.68 | Long customized cavity fits the full longitudinal outline of ABS-2 semiconductors, stops front-back sliding and overturning |
| K0 Cavity Depth | 1.55±0.05 | 1.55 | Moderate depth matches the thickness of ABS-2 chips, guarantees stable suction nozzle contact to reduce empty pick faults |
| D1 Draft Angle | 1.50 | 1.50 | Wide demolding angle accelerates mold forming cycle and ensures effortless component ejection at SMT stations |
Core Competitive Advantages
- Upgraded New Formula Black PC Raw Material: Better low-temperature toughness and anti-brittle performance than conventional PC tape, suitable for cold-region cross-border shipment and warehouse storage.
- Oversized Custom Cavity for ABS-2 Industrial Chips: Fully encloses bulky wide-length semiconductors with rounded smooth inner walls to protect delicate side pins from scratch and deformation.
- 8mm Widened Feed Hole Traction System: Solves slip and deviation faults common to standard 4mm pitch tapes when carrying heavy reels of large industrial chips.
- Integral Conductive Black Light-Shielding Structure: Permanent 10⁶~10⁹Ω/sq anti-static performance without coating shedding, blocks ambient light to prevent photosensitive industrial chip parameter drift.
- Bulk OEM Customization Support: Large-volume order discounts available, dedicated technical team adjusts cavity dimensions for special variant ABS-2 components, fast 3-day mold opening & revision service.
Main Application Scenarios
- ABS-2 packaged industrial control chips, power switch semiconductors, sensor drive ICs
- Factory automation equipment, industrial power modules, smart sensor mass assembly production lines
- Cross-border industrial electronics manufacturers requiring high temperature and cold resistance packaging materials
Q&A Session
Q: What performance improvements does the “new PC” material of LZ616 bring compared with ordinary PC carrier tape?
A: Traditional pure PC tape becomes brittle and easy to crack under low-temperature transportation. Our upgraded new PC formula adds modified toughening agents, improving low-temperature impact resistance while retaining stable conductive anti-static performance, perfectly adapting to long-distance sea freight and cold warehouse storage for industrial chips.
Q: Why design an oversized 5.50×6.68mm cavity for ABS-2 components?
A: ABS-2 industrial semiconductors have much wider and longer outlines than regular small SMD chips. Generic 12mm carrier tape cavities cannot fully wrap these components, leading to pin collision and chip tilting during winding. LZ616’s oversized pocket leaves minimal internal clearance to lock chips firmly and cut assembly scrap rates.
