LZ620 is a high-rigidity wide carrier tape built for tall, bulky 011-size SMD semiconductors, which have much larger body height than regular miniature chips. Ordinary thin transparent carrier tapes easily bend and deform under the heavy weight of tall components, while shallow pockets cannot accommodate the thick chip profile, resulting in component extrusion and damage.
Hatro upgrades LZ620 to a 0.25mm thick transparent PC substrate to greatly improve structural rigidity, eliminating warping on heavy full reels. The oversized 4.61×7.85×4.45mm extra-deep cavity fully encloses tall 011 components without squeezing the chip body or pins. The widened 8mm feed hole pitch delivers stronger traction for heavy wide tape rolls, preventing feeding slip during continuous high-speed taping. The fully transparent high-clarity PC material enables operators and machine vision systems to inspect component placement, tilt and surface defects directly through the tape, cutting cover tape waste and shortening QC inspection time. The 1.50° wide demolding angle ensures smooth mold stripping and easy component ejection during SMT mounting.
Core Specifications (EIA-481 Standard)
| Parameter | Standard Tolerance (mm) | LZ620 Value (mm) | Practical Industrial Benefit |
|---|---|---|---|
| W Tape Width | 12±0.10 | 12 | Standard wide width compatible with all 12mm wide-format taping and placement machines |
| P1 Feed Pitch | 8±0.10 | 8 | Wider sprocket pitch enhances traction for heavy reels loaded with tall 011 components, avoids tape deviation |
| T Base Thickness | 0.25±0.02 | 0.25 | Thickened transparent PC drastically improves rigidity, no permanent curling under heavy winding tension |
| A0 Cavity Width | 4.61±0.05 | 4.61 | Wide pocket fully accommodates the broad body of large 011 SMD chips |
| B0 Cavity Length | 7.85±0.05 | 7.85 | Extended cavity length locks the full longitudinal outline of long bulky components |
| K0 Cavity Depth | 4.45±0.05 | 4.45 | Extra-deep pocket perfectly holds tall thick 011 parts, prevents component extrusion and pin bending |
| D1 Draft Angle | 1.50 | 1.50 | Wide demolding angle accelerates mold forming cycle and ensures smooth chip pickup at SMT stations |
Core Advantages
- 4.45mm Extra-Deep High-Capacity Cavity: The only transparent wide tape with enough depth to fully encapsulate tall 011 bulky components without compression damage.
- 0.25mm Thickened Rigid Transparent PC: Solves the warping problem of thin clear tape under heavy component weight, keeps reels flat after long storage.
- Full Transparent Body for Visual QC: Real-time inline inspection without tearing cover tape, greatly reduces packaging material waste and labor cost for quality checks.
- 8mm Widened Feed Hole Traction: Prevents slip and jamming when running heavy full reels on 12mm high-speed taping lines.
- High-Clarity Virgin PC Raw Material: No yellowing or haze after long-term storage, stable transparency for months of component stock management.
Application Scenarios
- Tall bulky 011 SMD transistors, power diodes and large discrete semiconductors
- Packaging lines requiring 100% inline visual or AI vision quality inspection
- 12mm wide-format mass production lines with heavy component reels and strict flatness requirements
Q&A
Q: Why use a 4.45mm ultra-deep pocket for 011 components?
A: 011 chips have a much taller body than regular SMD parts. Ordinary shallow pockets will squeeze the component top and bend delicate pins. The extra-deep cavity provides enough internal height to fully contain the tall chip without pressure.
Q: What is the benefit of thick 0.25mm transparent PC compared with 0.20mm thin clear tape?
A: Transparent PC has lower rigidity than black conductive PC. When loaded with heavy tall 011 chips, thin 0.20mm clear tape will permanently curl after winding. The upgraded 0.25mm thickness improves structural strength to keep the tape flat through the whole production and shipping cycle.
