LZ629 is a wide-format carrier tape engineered specifically for ultra-flat 3810 miniature rectangular electronic components. Conventional deep-cavity carrier tapes cause thin flat chips to sink too far into the pocket, leading to repeated nozzle pick failure and costly production downtime. To solve this common industry pain point, Hatro designs an ultra-shallow 0.75mm pocket that keeps 3810 components nearly flush with the tape surface, ensuring stable, consistent pickup on continuous high-speed assembly lines.
The 0.23mm thin conductive PC base maintains good flexibility without permanent curling after multi-layer reel winding. The low-stick 0.50° small demolding angle minimizes mold sticking during mass thermoforming and improves production yield. The long narrow cavity (A0=1.14mm, B0=4.03mm) precisely matches the elongated outline of 3810 components, limiting lateral and longitudinal sliding to avoid component tilting. The black conductive PC material delivers permanent ESD protection and light shielding to prevent photosensitive miniature chips from light aging during long-term warehouse storage. All dimensions strictly comply with EIA-481 international carrier tape standards, fully compatible with mainstream 12mm taping and SMT placement machines worldwide.
Complete Technical Parameter Table
| Parameter Name | EIA-481 Tolerance (mm) | LZ629 Custom Value (mm) | Industrial Practical Advantages |
|---|---|---|---|
| W Tape Width | 12±0.10 | 12 | Universal wide width fits all global 12mm automated taping equipment, zero equipment modification cost |
| P1 Feed Hole Pitch | 4±0.10 | 4 | Standard sprocket pitch delivers smooth stable traction, eliminates skip-hole and tape jamming in non-stop mass production |
| T Base Thickness | 0.23±0.02 | 0.23 | Thin flexible conductive substrate resists winding deformation, keeps tape flat after thousands of reel layers |
| A0 Cavity Width | 1.14±0.05 | 1.14 | Narrow pocket width restricts lateral movement of slim flat 3810 chips |
| B0 Cavity Length | 4.03±0.05 | 4.03 | Elongated cavity fully wraps the long strip-shaped outline of 3810 rectangular components |
| K0 Cavity Depth | 0.75±0.05 | 0.75 | Ultra-shallow pocket prevents thin flat chips from sinking, drastically lowering empty pick rate in SMT processes |
| D1 Draft Angle | 0.50 | 0.50 | Gentle demolding angle reduces material adhesion on molds, improves continuous forming efficiency |
Core Competitive Advantages
- Ultra-Shallow 0.75mm Exclusive Pocket: Solves the long-standing empty pick problem of ultra-flat 3810 components, greatly boosting SMT production uptime.
- Long Narrow Elongated Cavity Design: Precisely fits slim rectangular 3810 chips, limiting component shaking and tilting during transportation and taping.
- 0.23mm Flexible Thin Conductive PC Base: Balances flexibility and flatness, no curling after long-term reel stacking and cross-border logistics.
- Integral Permanent Anti-Static Performance: Conductive agent evenly blended into raw material, no coating wear, full-cycle ESD protection for sensitive miniature components.
- One-Stop Supporting Packaging Accessories: Matching anti-static cover tape and standard plastic reels supplied together, rapid custom mold adjustment for variant 3810 part sizes.
Application Scenarios
- 3810-size flat miniature resistors, capacitors, diodes for consumer electronics, wearable devices, and IoT control modules
- High-speed SMT production lines with strict low empty pick rate requirements
- Component packaging factories with long-term mass orders for ultra-thin flat SMD chips
Q&A Session
Q: Why design such a shallow 0.75mm pocket for 3810 flat components?
A: 3810 chips are ultra-thin flat rectangular parts. Deep pockets make the component sink deep inside the cavity, so the suction nozzle cannot fully touch the chip surface, causing repeated pick failures. The ultra-shallow pocket keeps the part close to the tape surface to ensure stable pickup every cycle.
Q: What is the advantage of the 0.50° small demolding angle?
A: The gentle draft angle reduces friction between raw material and mold walls during thermoforming, lowering mold sticking and pocket blemish defects, which helps maintain consistent quality in 24-hour continuous mass production.
