As the core equipment of carrier tape substrate production, the performance of the extruder directly determines the quality and production efficiency of carrier tape. Traditional extruders have problems such as uneven temperature control, unstable extrusion speed and poor material plasticization, which easily lead to defects such as uneven thickness, surface scratches and insufficient conductivity of carrier tape, and the qualification rate is difficult to exceed 95%.
Recently, Xiamen Hatro Electronics Co., Ltd. launched a high-precision single-screw extruder specially designed for semiconductor carrier tape production. The equipment adopts a self-developed multi-zone intelligent temperature control system, with temperature control accuracy up to ±1℃, which effectively solves the problem of uneven material melting caused by temperature fluctuation. The optimized barrier screw structure increases the plasticization efficiency of PS conductive materials by 25%, and the extrusion speed is stable at 5-15m/min, which can be adjusted according to the thickness of carrier tape (0.1-0.5mm).
The extruder is equipped with an automatic pressure control module, which can real-time monitor the extrusion pressure and adjust it dynamically to avoid material overflow or insufficient extrusion. It is compatible with PS, PC, ABS and other common carrier tape substrates, and can realize continuous production for 24 hours with a failure rate of less than 1%. At present, the equipment has been put into use in more than 30 domestic carrier tape factories, helping customers increase the carrier tape qualification rate to more than 99.2% and reduce production costs by 18%.
In addition, the extruder adopts an energy-saving design, which reduces power consumption by 20% compared with traditional equipment, in line with the global green production trend. Hatro said that it will continue to optimize the extruder technology, integrate intelligent monitoring and data analysis functions, and provide more efficient and stable production equipment for the semiconductor packaging material industry.
