The pocket of carrier tape is used to place semiconductor components, and its dimensional accuracy and edge smoothness have strict requirements—for advanced packaging carrier tape, the pocket dimensional tolerance needs to be controlled within ±0.02mm, and the edge cannot have burrs or deformation, otherwise it will affect the placement of components and lead to贴装 failure.
Xiamen Hatro Electronics Co., Ltd. launched a precision die cutting machine for carrier tape, which adopts a self-developed high-precision die with a processing accuracy of ±0.01mm, ensuring the dimensional accuracy of carrier tape pockets. The servo positioning system of the equipment can realize precise positioning of carrier tape, with a positioning accuracy of ±0.005mm, avoiding the deviation of pocket position caused by carrier tape movement during die cutting.
The die cutting machine adopts a hydraulic die cutting structure, with stable die cutting force (0.5-2 tons) and adjustable speed (10-30 times per minute), which can adapt to die cutting of different thicknesses (0.1-0.5mm) and different specifications of carrier tape pockets (SOP-8, QFN, BGA, etc.). The integrated dust removal system can timely remove the debris generated during die cutting, avoiding debris adhering to the carrier tape and affecting product quality.
In addition, the equipment is equipped with an intelligent monitoring system, which can real-time monitor the die cutting process, and automatically alarm and stop when abnormalities such as die wear and carrier tape deviation occur, reducing product defects. At present, the precision die cutting machine has been used in the production of high-end carrier tape of Hatro, and the pocket qualification rate has reached 99.9%, which provides strong support for the production of high-precision carrier tape and helps domestic carrier tape manufacturers break through the technical bottleneck of pocket processing.
