LZ608 is a 12mm wide dedicated carrier tape designed for SMB surface-mount components. SMB devices feature larger body sizes and thicker profiles than small chip resistors, which put high demands on carrier tape structural rigidity and cavity internal space. Hatro adopts thickened 0.25mm conductive PC raw material to boost overall tape flatness and bending resistance, and customizes oversized deep cavities to fully wrap SMB components, preventing pin bending, surface scratch and component tipping during transportation and high-speed taping processes. Integral conductive modification maintains stable surface resistance between 10⁶~10⁹Ω/sq, effectively dissipating static electricity to avoid permanent damage to sensitive SMB power chips.
Core Specifications (Compliant with EIA-481 Industry Standards)
| Parameter Name | EIA-481 Industry Standard (mm) | Hatro Custom Parameter (mm) | Practical Advantages |
|---|---|---|---|
| W (Tape Width) | 12±0.10 | 12 | Fully compatible with all mainstream 12mm wide tape taping machines and high-speed SMT placement equipment, stable horizontal feeding without offset |
| P1 (Feed Hole Pitch) | 8±0.10 | 8 | 8mm extended sprocket pitch improves traction stability for wide heavy tape rolls, effectively avoiding tape slip during continuous operation |
| T (Base Thickness) | 0.25±0.02 | 0.25 | Thickened substrate greatly enhances structural rigidity, resists curling and deformation after months of stacking and cold storage |
| A0 (Cavity Width) | 3.91±0.05 | 3.91 | 1:1 matched width for SMB component body, limits left-right displacement inside the pocket |
| B0 (Cavity Length) | 5.82±0.05 | 5.82 | Long customized cavity fits full length of SMB chips, restricts front-back sliding and component overturn |
| K0 (Cavity Depth) | 2.72±0.05 | 2.72 | Extra deep cavity accommodates thick SMB component profiles, avoids extrusion and surface abrasion |
| D1 (Draft Angle) | 1.50 | 1.50 | Wide demolding angle ensures smooth mold stripping during forming and effortless suction nozzle pickup at SMT stations |
Key Advantages
- 0.25mm Thickened High-Rigidity PC Base: Solves the inherent warping defect of standard thin 12mm carrier tapes, maintains flat feeding for long production shifts.
- Oversized Deep Cavity for SMB Chips: 3.91×5.82×2.72mm large pocket provides sufficient buffer space for medium-large SMB components, cutting scrap rate caused by component collision.
- Integral Conductive Black PC ESD Protection: Permanent anti-static performance without surface coating shedding, black substrate shields light to prevent performance drift of photosensitive semiconductors.
- 8mm Extended Feed Hole Pitch: Optimized traction design for heavy wide tape rolls, eliminates slip and jam faults in high-speed taping lines.
- Full Set 12mm Supporting Accessories: Matching wide cover tape and large-diameter plastic reels available in one order, fast mold revision service for special SMB variant sizes.
Application Scenarios
- SMB packaged power diodes, voltage regulators and switching semiconductors
- Automotive electronics, industrial control power modules, new energy circuit mass assembly
- Wide-width 12mm SMT production lines requiring heavy-load stable feeding and permanent anti-static performance
Q&A
Q: Why use a thickened 0.25mm base instead of standard 0.20mm for 12mm SMB carrier tape?
A: 12mm wide tape bears heavier winding tension than narrow 8mm tape; thin substrates easily curl and deform after long storage. The 0.25mm thickened PC base improves bending resistance, keeping the tape flat during feeding and avoiding machine alarm downtime.
Q: What benefits does the 8mm feed hole pitch bring compared with common 4mm pitch?
A: Wider 8mm sprocket holes increase contact area with machine drive gears, delivering stronger traction for heavy full rolls of 12mm tape, preventing slip and tape deviation during uninterrupted high-speed production.
