In the semiconductor tape-and-reel packaging field, 12mm embossed carrier tape is the mainstream packaging carrier for medium and low-power devices such as SOT89 and SOP8. The 9.3mm cover tape that precisely matches it is the core key to ensuring firm sealing and smooth placement. Even a tiny width deviation can cause sealing edge leakage, peeling jamming, component falling off and other issues, directly reducing production line efficiency.
Relying on the high-performance EC600-N2 substrate, Hatro has created an exclusive 9.3mm precision heat-seal cover tape, with all parameters benchmarked against national standards and optimized for the sealing characteristics of 12mm carrier tape. With extreme dimensional accuracy, stable peel force and long-lasting ESD protection, it has become the golden partner of 12mm carrier tape, building a solid full-process protection barrier for the packaging of medium and low-power semiconductor devices.
Precision Dimensional Matching, Zero Sealing Deviation for 12mm Carrier Tape
Hatro’s 9.3mm cover tape strictly complies with the GB/T 6673-2001 standard, with the width tolerance of slitted products precisely controlled at ±0.1mm and a uniform thickness of 52±5μm, perfectly fitting the sealing edge of 12mm carrier tape: no edge warping or middle missing seal during sealing, forming a closed protective space to effectively isolate dust, moisture and mechanical damage, keeping devices intact throughout storage and transportation; at the same time, the sealing point avoids the PET edge layer of the cover tape, fundamentally avoiding delamination and tape breakage caused by excessive sealing, and adapting to the continuous operation needs of automated high-speed production lines.
Gradient Controllable Peel Force, Full Adaptation to Placement Scenarios
Based on the excellent heat-sealing characteristics of the EC600-N2 substrate, the 9.3mm cover tape achieves stable and controllable peel force in the full temperature range of 120℃-180℃. Under laboratory standardized testing (0.3Mpa sealing pressure, 0.8mm sealing width, 0.2sec sealing time), the peel force is in the optimal use range of 30-90g.f: 120℃ low-temperature heat sealing is suitable for heat-sensitive devices, 150℃ mainstream temperature meets conventional placement needs, 180℃ high-temperature achieves high-firmness sealing, with a fluctuation rate of ≤5%. During the tape pulling process of high-speed placement machines, the cover tape is opened smoothly without flying components or adhesion, and the placement yield is stably over 99.9%, completely solving the pain points of material rejection and misalignment caused by unstable peel force.
Hard-Core Performance Support, Full-Process Device Protection
In terms of optical properties, the cover tape has a light transmittance of ≥80% and a haze of ≤30%, perfectly adapting to AOI optical inspection with no blind spots or glare in device identification; in terms of ESD protection, the surface resistivity is stably at 10⁶~10¹¹Ω/sq, with long-lasting electrostatic dissipation to avoid functional failure of medium and low-power devices caused by electrostatic breakdown; in terms of mechanical properties, the tensile strength is ≥20N and the elongation at break is ≥90%, with excellent tension and fracture resistance, no cracking during winding and tape pulling, adapting to the high-speed feeding needs of 12mm carrier tape.
Standardized Storage and Usage, Long-Lasting Stable Performance
This cover tape has a 1-year storage life with no performance attenuation when stored in a clean and dry warehouse at 0℃-45℃ and 40%RH-60%RH; it is compatible with all types of standard SMT heat-sealing equipment in use, and continuous heat sealing is recommended, with parameters fine-tuned according to actual equipment to ensure the peel force is in the optimal range. Widely applicable to devices such as SOT89 transistors, SOP8 micro ICs and medium and low-power MOS tubes, it is the first choice for 12mm carrier tape packaging in consumer electronics, industrial control boards, smart home and other fields.
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